New Product Design CapabilityBoard layout and Design CapabilityDesign for manufacturingNew Product IntroductionManufacturing EngineeringResearch and DevelopmentHardware and software engineeringCAD / CAMComplete productsSurface mountAutomated and Manual
Through hole InsertionBGAFlex linesBox build and IntegrationIn CircuitFunctionalElevated TemperatureMold making and Plastic Injection
Molding
Wiring harness
DEK / MPM – SOLDER PASTE PRINTING FUJI NXT3 – CHIP SHOOTERJUKI / YAMAHA – PICK & PLACEHELLER/VITRONICS – REFLOW OVENAKI – AOIFIEN FOCUS – X RAY INSPECTIONAPE INTRUDER – BGA REWORK STATION Z100 – SOLDER PASTE HEIGHT MEASUREMENTDE-HUMIDIFIER FOR MSD COMPONENTSLAMINAR FLOOR - FOR LENS ASSEMBLY
SEHO / EMS – WAVE SOLDERINGUNIVERSAL – AUTO INSERTS & SEQUENCERSICT – JETOLAMEF – COMPONENT FORMINGDEDICATED TEST BENCHESELEVATED BURN IN FACILITIESPROTO ASSEMBLY LINESFUNCTIONAL JIGS
COMPLETE PRODUCT ASSEMBLY LINETHERMAL CHAMBERVIBRATION TEST SYSTEMBURNIN LINES FOR THE FINAL PRODUCTDEDICATED TEST EQUIPMENT FOR PRODUCT
TESTING
End to End solutionsfrom Design to Delivery
Quality standards as per IPC-610EDedicated team for proto-typeDocument Control & IP protectionDedicated member team
Design modification / PCB design capabilityAlternate solution for Obsolete partsSupport for EMI/EMC/UL/CE approvals“Digital combines global resources with in house capabilitiesto create local success for our Customers”
High Speed Digital, Analog, Mixed & RF
designsHigh layer count boards – 12+ layersHigh density PCBs – > 450 pins/Sq.InFine pitch BGAFlexible & Rigid flex PCBDesign for ManufacturabilityHighly skilled PCB / software engineers
Best in Industry rates and competitive
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